Copper plating is a electrolytically deposited metal finish that has functional and decorative characteristics. Decorative finishes are often lacquered after plating due to the fact copper readily oxides. Functional copper is used because of its excellent electrical and thermal conductivity. Copper is also used as a base layer or underplating. The benefits of underplating are improvements in final finish, adhesion and corrosion resistance.
Class 0 – 0.001-0.005 inches minimum deposit thickness
Class 1 – 0.001 inch minimum deposit thickness
Class 2 – 0.0005 inch minimum deposit thickness
Class 3 – 0.0002 inch minimum deposit thickness
Class 4 – 0.0001 inch minimum deposit thickness
Intended Uses per Section 6.1 of MIL-C-14550:
Class 0 – for heat treatment stop-off shield
Class 1 – for carburizing shield, decarburizing shield and printed circuit board plated through holes or as specified on the engineering drawing.
Class 2 – for undercoating for nickel and other metals
Class 3 – to prevent basis metal migration into tin layer to poison solderability
Class 4 – 0.0001 inch same as 0.0002 inch
Class 25 – 25um or 0.001″ minimum coating thickness
Class 20 – 20um or 0.0008″ minimum coating thickness
Class 12 – 12um or 0.00048″ minimum coating thickness
Class 5 – 5um or 0.0002″ minimum coating thickness
Class X – Thickness as specified [um]
Copper plating is RoHS compliant.